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HMC611
v01.0408
60 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 10000 MHz
Typical Applications
The HMC611 is ideal for: * Cellular/PCS/3G * WiMAX, WiBro, WLAN, Fixed Wireless & Radar * Power Monitoring & Control Circuitry
Features
Wide Dynamic Range: Up to 73 dB High Accuracy: 1 dB with 51 dB Range Up to 8 GHz Supply Voltage: +5V Excellent Stability over Temperature Buffered Temperature Sensor Output Die Size: 1.39 x 1.34 x 0.25 mm
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POWER DETECTORS - CHIP
* Receiver Signal Strength Indication (RSSI) * Automatic Gain & Power Control
Functional Diagram
General Description
The HMC611 Logarithmic Detector/Controller generates a voltage that is proportional to the log of the RF power envelop presented to its input. The HMC611 employs a successive compression topology which delivers extremely high dynamic range and conversion accuracy over a wide input frequency range. As the input power is increased, successive amplifiers move into saturation one by one creating an accurate approximation of the logarithm function. The output of a series of square law detectors is summed, converted into voltage domain and buffered to drive the LOGOUT output. For detection mode, the LOGOUT pin is shorted to the VSET input, and will provide a nominal logarithmic slope of -25 mV/ dB and an intercept of 9 dBm (24 dBm for 5.8 GHz). The HMC611 can also be used in the controller mode where an external voltage is applied to the VSET pin, to create an AGC or APC feedback loop.
Electrical Specifi cations, TA = +25C[1] , Vcc1 = 5V, Vcc2 = 5v
Parameter Input Frequency 3 dB Dynamic Range 3 dB Dynamic Range Center 1 dB Dynamic Range Output Slope Output Intercept Temperature Sensitivity @ -10 dBm Input [2] Typ. 50 71 -35.5 62 -25.5 9.7 10.2 Typ. 100 71 -35.5 62 -25.4 10.4 10.3 Typ. 900 72 -35 61 -25.2 9.8 8.4 Typ. 1900 72 -38 62 -24.6 8.5 7.1 Typ. 2200 72 -37 62 -24.7 9.7 8.3 Typ. 3600 73 -30.5 65 -24.0 12.1 10.3 Typ. 5800 63 -20.5 57 -24.2 24.8 -8.9 Typ. 7000 64 -20 56 -26 21.4 2.4 Typ. 7500 62 -21 55 -26.8 18.9 3.3 Typ. 8000 61 -20.5 51 -28.4 16.1 7.0 Typ. 10000 51 -18.5 42 -32.7 14.3 18.3 Units MHz dB dBm dB mV/dB dBm x10 -3 x dBm/C
[1] Detector mode measurements; LOGOUT (Pin 18) is shorted to VSET (Pin 17). [2] Measured from TA = -55C to TA = +85C
12 - 2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC611
v01.0408
60 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 10000 MHz
Electrical Specifi cations, (continued)
Parameter LOGOUT Interface Output Voltage Range Output Rise Time/Fall Time VSET Interface Input Impedance Input Voltage Range Low Frequency Gain Open Loop Corner Frequency Power Down (EN) Interface Voltage Range for Normal Mode Voltage Range for Powerdown Mode Threshold Voltage Power Supply (Vcc1, Vcc2) Operating Voltage Range Supply Current in Normal Mode Supply Current in Power Down Mode 4.5 103 1 5.5 120 V mA mA 0.8 x Vcc [1] 0 Vcc [1]/2 Vcc [1] 0.2 x Vcc [1] V V V
[2]
Conditions
Min.
Typ.
Max.
Units
0 From 10% to 90% 2.5 / 57
Vcc -1.0
V s
30 0.25 to 1.35 VSET to LOGOUT 56 700
k V dB kHz
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POWER DETECTORS - CHIP
ERROR (dB)
[1] Vcc= Vcc1= Vcc2= +5V [2] This parameter describes the open loop gain bandwidth of the HMC611 output amplifier with no feedback from VSET to LOGOUT.
Test Conditions
Parameter Vcc1 = Vcc2 Input Zo - w/ 68 Term Resistor at IN+ TA Fin (CW) Condition +5V 50 +25 C 900 MHz
IN- Port connected to ground through a 1000pF capacitor
Temperature Compensation Component Values Used at Key Application Frequencies with Vcc = +5V
Component R8 Frequency (MHz) 50 562 100 562 900 562 1900 562 2200 562 3600 562 5800 562 7000 562 7500 562 8000 0 10000 0
LOGOUT Voltage & Error vs. Input Power, Fin = 50 MHz
2.6 2.2 1.8 1.4 1 0.6 0.2 -70 -60 -50 -40 -30 -20 -10 0 10 INPUT POWER (dBm)
ERR (+25C) ERR (+85C) ERR (-55C) Ideal Logout (+25C) Logout (+85C) Logout (-55C)
LOGOUT Voltage & Error vs. Input Power, Fin = 100 MHz
3 2 1 ERROR (dB) 0 -1 -2 -3 2.6 2.2 1.8 1.4 1 0.6 0.2 -70 -60 -50 -40 -30 -20 -10 0 10 INPUT POWER (dBm)
Ideal Logout (+25C) Logout (+85C) Logout (-55C)
3 2 1 0 -1 -2 -3
LOGOUT (V)
LOGOUT (V)
ERR (+25C) ERR (+85C) ERR (-55C)
Unless otherwise noted: Vcc1, Vcc2 = +5V, TA = +25C
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
12 - 3
HMC611
v01.0408
60 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 10000 MHz
LOGOUT Voltage & Error vs. Input Power, Fin = 1900 MHz
3 2.6 2.2 1.8 1.4 1 0.6 0.2 -70
Ideal Logout (+25C) Logout (+85C) Logout (-55C)
LOGOUT Voltage & Error vs. Input Power, Fin = 900 MHz
2.6 2.2 1.8 1.4 1 0.6
Ideal Logout (+25C) Logout (+85C) Logout (-55C)
3 2 1 ERROR (dB) 0 -1 -2 -3 -60 -50 -40 -30 -20 -10 0 10
2 1 ERROR (dB) 0 -1 -2 -3
LOGOUT (V)
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POWER DETECTORS - CHIP
LOGOUT (V)
ERR (+25C) ERR (+85C) ERR (-55C)
ERR (+25C) ERR (+85C) ERR (-55C)
0.2 -70 -60 -50 -40 -30 -20 -10 0 10
INPUT POWER (dBm)
INPUT POWER (dBm)
LOGOUT Voltage & Error vs. Input Power, Fin = 2200 MHz
2.6 2.2 1.8 1.4 1 0.6 0.2 -70
ERR (+25C) ERR (+85C) ERR (-55C) Ideal Logout (+25C) Logout (+85C) Logout (-55C)
LOGOUT Voltage & Error vs. Input Power, Fin = 3600 MHz
3 2 1 ERROR (dB) 0 -1 -2 -3 2.6 2.2 1.8 1.4 1 0.6 0.2 -70
ERR (+25C) ERR (+85C) ERR (-55C)
3 2 1 ERROR (dB) 0 -1 -2 -3 -60 -50 -40 -30 -20 -10 0
Ideal Logout (+25C) Logout (+85C) Logout (-55C)
LOGOUT (V)
-60
-50
-40
-30
-20
-10
0
10
INPUT POWER (dBm)
LOGOUT (V)
INPUT POWER (dBm)
LOGOUT Voltage & Error vs. Input Power, Fin = 5800 MHz
2.6 2.2 1.8 1.4 1 0.6 0.2 -60
ERR (+25c) ERR (+85c) ERR (-55c) Ideal Logout (+25c) Logout (+85c) Logout (-55c)
LOGOUT Voltage & Error vs. Input Power, Fin = 7000 MHz
3 2 1 ERROR (dB) 0 -1 -2 -3 2.6 2.2 1.8 1.4 1 0.6 0.2 -60 -50 -40 -30 -20 -10 0
ERR (+25C) ERR (+85C) ERR (-55C) Ideal Logout (+25C) Logout (+85C) Logout (-55C)
3 2 1 ERROR (dB) 0 -1 -2 -3 10
LOGOUT (V)
-50
-40
-30
-20
-10
0
10
INPUT POWER (dBm)
LOGOUT (V)
INPUT POWER (dBm)
Unless otherwise noted: Vcc1, Vcc2 = +5V, TA = +25C
12 - 4
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC611
v01.0408
60 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 10000 MHz
LOGOUT Voltage & Error vs. Input Power, Fin = 8000 MHz
3 2.6 2.2 1.8 1.4 1 0.6 0.2 -60
Ideal Logout (+25C) Logout (+85C) Logout (-55C)
LOGOUT Voltage & Error vs. Input Power, Fin = 7500 MHz
2.6 2.2 1.8 1.4 1 0.6 0.2 -60
ERR (+25C) ERR (+85C) ERR (-55C) Ideal Logout (+25C) Logout (+85C) Logout (-55C)
3 2 1 ERROR (dB) 0 -1 -2 -3 -50 -40 -30 -20 -10 0 10 INPUT POWER (dBm)
2 1 ERROR (dB) 0 -1 -2 -3
LOGOUT (V)
LOGOUT (V)
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POWER DETECTORS - CHIP
12 - 5
ERR (+25C) ERR (+85C) ERR (-55C)
-50
-40
-30
-20
-10
0
10
INPUT POWER (dBm)
LOGOUT Voltage & Error vs. Input Power, Fin = 10000 MHz
2.4
ERR (+25C) ERR (+85C) ERR (-55C)
4
1.8 LOGOUT (V)
2 ERROR (dB)
1.2
0
0.6
Ideal Logout (+25C) Logout (+85C) Logout (-55C)
-2
0 -50
-4 -40 -30 -20 -10 0 10
INPUT POWER (dBm)
LOGOUT Slope vs. Frequency
-20 -22 SLOPE (mV/dB) -24 -26 -28 -30 -32 50 2000 4000 6000 8000 10000 FREQUENCY (MHz)
+25 C +85 C -55C
LOGOUT Slope vs. Supply Voltage
-25
SLOPE (mV/dB)
-27
-29
-31
-33 4.5
100 MHz 1900 MHz 3600 MHz 5800 MHz 8000MHz 10000 MHz
5 Vcc (Volts)
5.5
Unless otherwise noted: Vcc1, Vcc2 = +5V, TA = +25C
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC611
v01.0408
60 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 10000 MHz
LOGOUT Intercept vs. Frequency
25
LOGOUT Intercept vs. Supply Voltage
27
15
INTERCEPT (dBm)
20 INTERCEPT (dB)
+25 C +85 C -55 C
22
100 MHz 1900 MHz 3600 MHz
5800 MHz 8000 MHz 10000 MHz
17
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POWER DETECTORS - CHIP
10
12
5 0 2000 4000 6000 8000 10000 FREQUENCY (MHz)
7 4.5
5 Vcc1, Vcc2 (Volts)
5.5
LOGOUT Error vs. Input Power, Normalized [2], Fin= 1900 MHz
2 RELATIVE ERROR TO 25C (dB) 1.5 1 0.5 0 -0.5
Input Impedance vs Frequency [3]
0.9
1.0
0.7
1.4
S11
0 .6
0.8
1.2
1.6
1.8
S11
2 .0
0.
5
3.
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.4
1.6
1.8
2.0
3.0
4.0
5.0
-1.5
0
0.05GHz
-60
-50
-40
-30
-20
-10
0
10
0.1
INPUT POWER (dBm)
RF Cafe 2002
5.0
0.2
LOGOUT Voltage vs. Input Power & Frequency
2.5
50 MHz 900 MHz 2200 MHz 5800MHz 7500MHz 10000MHz
0 .3
0 3.
0.
4
5
0 .6
0.7
0.8
0.9
2 LOGOUT (V)
1.5
1
0.5
0 -70
-60
-50
-40
-30
-20
-10
0
10
INPUT POWER (dBm)
[1] Unless otherwise noted: Vcc1, Vcc2 = +5V, TA = +25C [2] This data is relative to the room temperature performance of the HMC611 [3] Reference plane at input pad on test block
12 - 6
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
1.0
1.2
1.4
1 .6
1.8
2 .0
0.
8.0 10
0.9GHz
20
-2 -70
1.9GHz
10.0GHz
10
6.0
4.0
0.1
-1
+85 C -55 C
0.
4
0.3
3.6GHz
0.2
4.0 5.0
8.0GHz
6.0
8.0 10
2.2GHz 5.8GHz
20
HMC611
v01.0408
60 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 10000 MHz
Absolute Maximum Ratings
Vcc1, Vcc2 EN VSET Input Voltage LOGOUT Output Current RF Input Power Junction Temperature Continuous Pdiss (T = 85C) (Derate 21.6 mW/C above 85C) Thermal Resistance (Rth) (junction to die bottom) Storage Temperature Operating Temperature +5.6V +5.6V +5.6V 3 mA +15 dBm 125 C 0.86 Watts 46.6 C/W -65 to +150 C -40 to +85 C
ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
Die Pad Dimensions
Pads 1, 2, 8, 13, 14, 15, 16, 20, 21, 22, 24, 26 3, 4, 5, 6, 7, 9, 10, 11, 12, 17, 18, 19, 23, 25, 27, 28, 29, 30, 31 Pad Size .0024 [0.100] x .0052 [0.193] .0024 [0.100] x .0024 [0.100]
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POWER DETECTORS - CHIP
12 - 7
Outline Drawing
Die Packaging Information [1]
Standard WP-3 Alternate [2]
[1] Refer to the "Packaging Information" section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation.
NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] 2. DIE THICKNESS IS 0.010 [0.25] 3. TYPICAL BOND PAD IS 0.0024 SQUARE 4. BOND PAD METALIZATION: GOLD 5. BACKSIDE METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND 7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 8. OVERALL DIE SIZE IS .002
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC611
v01.0408
60 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 10000 MHz
Pad Descriptions
Pad Number Function Description Interface Schematic
1, 2
IN-, IN+
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POWER DETECTORS - CHIP
RF Input pads. Connect RF to IN+, and AC couple IN- to ground for single-ended operation.
3
TEMP
Temperature sensor output pin
4, 5, 7, 9, 10, 15, 16, 23, 25, 27-30 Die Bottom
GND
Die bottom must be connected to RF and DC ground.
6, 8, 13, 14, 20-22, 24, 26
Vcc1, Vcc2
Bias supply. Connect supply voltage to these pins with appropriate filtering.
11, 12
CPA, CPB
Temperature compensation pins.
17
VSET
VSET input in controller mode. Short this pin to LOGOUT for detector mode.
12 - 8
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC611
v01.0408
60 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 10000 MHz
Pad Descriptions (Continued)
Pad Number Function Description Interface Schematic
18
LOGOUT
Logarithmic output that converts the input power to a DC level in detector mode. Short this pin to VSET for detector mode.
12
POWER DETECTORS - CHIP
12 - 9
19
CLPF
Loop filter capacitor for output ripple filtering.
31
EN
Enable pad, connect to Vcc1 or Vcc2 for normal operation. Applying voltage <0.2 x (Vcc1, Vcc2) will initiate power saving mode.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC611
v01.0408
60 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 10000 MHz
Application Circuit
12
POWER DETECTORS - CHIP
Note 1: For detector mode, connect high impedance volt meter to the LOGOUT port. LOGOUT is shorted to VSET, as required for detector mode. Note 2: For controller mode, remove short between LOGOUT and VSET. In controller mode, the LOGOUT output can be used to drive a variable gain amplifier, or a variable attenuator, either directly or through a buffer or microcontroller. VSET should be connected to an external control voltage, typically between +0.6 and +1.9V.
Assembly Diagram
12 - 10
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
HMC611
v01.0408
60 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 10000 MHz
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be placed as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils).
0.102mm (0.004") Thick GaAs MMIC
Wire Bond 0.076mm (0.003")
RF Ground Plane
12
POWER DETECTORS - CHIP
12 - 11
0.127mm (0.005") Thick Alumina Thin Film Substrate Figure 1.
Handling Precautions
Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: strikes. Follow ESD precautions to protect against ESD
0.150mm (0.005") Thick Moly Tab 0.254mm (0.010") Thick Alumina Thin Film Substrate Figure 2.
0.102mm (0.004") Thick GaAs MMIC
Wire Bond 0.076mm (0.003")
RF Ground Plane
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pickup.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C and a tool temperature of 265 C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 C. DO NOT expose the chip to a temperature greater than 320 C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule.
Wire Bonding
RF bonds made with two 1 mil wires are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a nominal stage temperature of 150 C. A minimum amount of ultrasonic energy should be applied to achieve reliable bonds. All bonds should be as short as possible, less than 12 mils (0.31 mm).
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

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